DDR3
第三代DDR SDRAM(第三代双倍数据速率同步动态随机存取存储器)广泛使用于电子设备中。如电视、机顶盒、OTT、平板、POE、BD播放器等。它通过较高的时钟频率达到比之前DDR2 SDRAM更高的数据带宽。
SCB15H1G800AF
Technical Specifications
SCB15H1G800CF
Technical Specifications
SCB15H1G160CF
Technical Specifications
SCB13H1G160DF
Technical Specifications
SCB15H1G160AF
Technical Specifications
SCB15H2G160AF
Technical Specifications
SCB13H2G160AF
Technical Specifications
SCB13H2G160EF
Technical Specifications
SCB15H2G800AF
Technical Specifications
SCB13H2G800EF
Technical Specifications
SCB13H2G800AF
Technical Specifications
SCB13H2G800DF
Technical Specifications
SCB13H4G160AF
Technical Specifications
SCB13H4G800AF
Technical Specifications
SCB13H8G802BF
Technical Specifications
Notes
· Temperature Specification
C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C;SDR, DDR: 0°C ~ +70°C)
I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)
A1 = Automotive grade 1(-40°C ~ +125°C)
A2 = Automotive grade 2(-40°C ~ +105°C)
A25 = Automotive grade 2(-40°C ~ +115°C)
A3 = Automotive grade 3(-40°C ~ +95°C);LPDDR4(-40°C ~ +85°C)
· MP Mass Production
友情链接
版权所有西安紫光国芯半导体有限公司 All Rights Reserved.
陕ICP备14006572号 ; 陕公网安备 61019002001302号 ![]() www.unisemicon.com | 联系总部 |