- Part No.
- Den.
- Org.
- Voltage
- Package
- Dim.(mm)
- Status
- Speed
- Temperature
- Model
SCB4BL256160AF
Technical Specifications
- Capacity:256Mb
- Organization:16Mbx16
- Width:11.5x13
- Package:FBGA162
- Voltage:1.2V
- RoHS:
Speed-Options
- Data-RateCAS-RCD-RP LatenciesColck RateCycle Time
Download
Datasheet- IBIS
SCB4BL256800AF
Technical Specifications
- Capacity:256Mb
- Organization:32Mbx8
- Width:11.5x13
- Package:FBGA162
- Voltage:1.2V
- RoHS:
Speed-Options
- Data-RateCAS-RCD-RP LatenciesColck RateCycle Time
Download
- Datasheet
- IBIS
SCB4BL512320AF-
Technical Specifications
- Capacity:512Mb
- Organization:16Mbx32
- Width:11.5x13
- Package:FBGA221
- Voltage:1.2V
- RoHS:
Speed-Options
- Data-RateCAS-RCD-RP LatenciesColck RateCycle Time
Download
- Datasheet
- IBIS
Notes
·Temperature Specification
C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C；SDR, DDR: 0°C ~ +70°C)
I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)
A1 = Automotive grade 1(-40°C ~ +125°C)
A2 = Automotive grade 2(-40°C ~ +105°C)
A25 = Automotive grade 2(-40°C ~ +115°C)
A3 = Automotive grade 3(-40°C ~ +95°C)；LPDDR4(-40°C ~ +85°C)
· MP Mass Production
